Tomoko Wake
9Patents
6h-index
5Co-inventors
45Inventor score
Filing activity: Nov 30, 1998 → Jun 5, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6530968B2 | Chemical mechanical polishing slurry | Chemistry; Metallurgy | 41 | Expired |
| US6436811B1 | Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry | Electricity | 25 | Expired |
| US6725119B1 | Cleaning-apparatus line configuration and designing process therefor | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6585568B2 | Chemical mechanical polishing slurry | Chemistry; Metallurgy | 21 | Expired |
| US6319801A | Method for cleaning a substrate and cleaning solution | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6478834B2 | Slurry for chemical mechanical polishing | Chemistry; Metallurgy | 7 | Expired |
| US6585786B2 | Slurry for chemical mechanical polishing | Chemistry; Metallurgy | 5 | Expired |
| US6930037B2 | Process for forming a metal interconnect | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6867139B2 | Method of manufacturing semiconductor device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.