Polishing carrier head
US6726537B1 · kind B1 · utility
10Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.