Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6726823B1 · kind B1 · utility
71Cited by
6References
150Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.