Wafer pedestal tilt mechanism
US6727509B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31701
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a wafer pad assembly and actuation system for use in an ion implanter, preferably a batch-type ion implanter. The wafer pad assembly includes a rotatable wafer support pad having an upper surface for mounting the wafer, and a lower surface rotationally mounted to a housing of the wafer pad assembly. The lower surface of the wafer support pad further comprises a flange connected to a rotatable shaft. The shaft is connected to an actuator for selectively indexing the shaft so that the wafer support pad is rotationally indexed about its geometric center. The lower surface of the wafer support pad is also connected to a frame having an outer curved surface rotatably mounted within a mating bearing surface of a housing. The curved frame is connected to a plurality of linkages for moving the wafer support pad within the curved frame so that the wafer is pivotable or tiltable about its geometric center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.