Semiconductor module
US6727581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2002 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Oct 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a case that a bare chip has been detected as being defective from among bare chips, a good chip is mounted to the rear surface of the surface wherein the bare chips are provided to a semiconductor module substrate so that a QFC pin of the bare chip is fixed at the ground potential (GND). Thereby, the bare chip stops the output of a signal to the input/output terminals or the input of a signal from the input/output terminals. As a result, the good chip outputs an electrical signal to the input/output terminals or an electrical signal is inputted from the input/output terminals. Thereby, a semiconductor module is gained that can be repaired even in the case that a defective chip is detected after the chip has been molded into a mold resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.