Polybenzoxazine based wafer-level underfill material
US6727594B2 · kind B2 · utility
4Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2002 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Jan 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polybenzoxazine based wafer-level underfill material. The material may be provided to a surface of a semiconductor wafer. The semiconductor wafer may then be sawed into individual chips. The polybenzoxazine based underfill material may be for use between a chip and a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.