Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
US6729935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.