Pre-ECD wet surface modification to improve wettability and reduced void defect

US6730597B1 · kind B1 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Jiong-Ping Lu · Richardson, US
• Linlin Chen · Kalispell, US
• David Gonzalez · Austin, US
• Honglin Guo · Plano, US

Key dates

• Filing date: Sep 21, 2000
• Grant date: May 4, 2004
• Expiry date: Sep 21, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76877
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A pre-ECD wet surface treatment. After forming the barrier material (110) and seed layer (112), the surface of the seed layer (112) is treated with a water-based solution to remove surface contamination (122) and improve wettability. The ECD copper film (124) is then formed over the seed layer (112).