Linlin Chen
39Patents
16h-index
42Co-inventors
81Inventor score
Filing activity: Mar 20, 1998 → Aug 15, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6197181A | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece | Electricity | 440 | Expired |
| US6565729B2 | Method for electrochemically depositing metal on a semiconductor workpiece | Emerging Cross-Sectional Technologies | 328 | Expired |
| US6932892B2 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Electricity | 176 | Expired |
| US6277263A | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Electricity | 96 | Expired |
| US6638410B2 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Electricity | 83 | Expired |
| USD828342S1 | Smart home hub | General | 73 | Active |
| US6290833A | Method for electrolytically depositing copper on a semiconductor workpiece | Electricity | 71 | Expired |
| US6309524A | Methods and apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 64 | Expired |
| US6309520A | Methods and apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 61 | Expired |
| US6303010A | Methods and apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 55 | Expired |
| US6508920B1 | Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | Electricity | 41 | Expired |
| US6632345B1 | Apparatus and method for electrolytically depositing a metal on a workpiece | Electricity | 28 | Expired |
| US6306276A | Aqueous electrodeposition of rare earth and transition metals | Chemistry; Metallurgy | 22 | Expired |
| US6869510B2 | Methods and apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 22 | Expired |
| US6699373B2 | Apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 19 | Expired |
| US6645356B1 | Methods and apparatus for processing the surface of a microelectronic workpiece | Chemistry; Metallurgy | 16 | Expired |
| US6811675B2 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Electricity | 13 | Expired |
| US6743719B1 | Method for forming a conductive copper structure | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7332066B2 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6527925B1 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Chemistry; Metallurgy | 11 | Expired |
| US6911127B2 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Chemistry; Metallurgy | 10 | Expired |
| US6806186B2 | Submicron metallization using electrochemical deposition | Electricity | 9 | Expired |
| US7135404B2 | Method for applying metal features onto barrier layers using electrochemical deposition | Electricity | 8 | Expired |
| US6998275B2 | Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application | Electricity | 8 | Expired |
| US6730597B1 | Pre-ECD wet surface modification to improve wettability and reduced void defect | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.