Integration of annealing capability into metal deposition or CMP tool
US6730598B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1999 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Dec 30, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Integration of annealing capability into a metal deposition tool or a chemical mechanical polishing (CMP) tool. A wafer processing apparatus includes a metal deposition tool having annealing capability. The metal deposition tool can be an electroplating tool or a chemical vapor deposition tool or other metal deposition tool that deposits metal films, such as copper, onto silicon substrates for integrated circuit manufacturing. An annealing chamber is integrated into the metal deposition tool so that annealing of the metal film can be controlled such that the copper is consistently stabilized in preparation for a chemical mechanical polishing process. Alternatively, an annealing chamber can be integrated into a CMP tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.