Multiple fiber chip clamp
US6731853B2 · kind B2 · utility
3Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Sep 21, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3839
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.