Vented cavity, hermetic solder seal
US6732905B2 · kind B2 · utility
2Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | May 18, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.