Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof
US6734074B2 · kind B2 · utility
9Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/0073
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Within both a micro fabrication and a method for fabricating the micro fabrication there is formed over a substrate a spirally patterned conductor layer spirally topographically tapered in a vortex shape. The spirally patterned conductor layer is particularly useful as a microelectronic inductor structure within a microelectronic fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.