Dielectric material treatment
US6734118B2 · kind B2 · utility
6Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Sep 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Treatment of dielectric material includes using a directed energy to break bonds in a dielectric material and a reactive gas to repair those bonds with an element of the reactive gas. The treated dielectric material may exhibit greater mechanical strength without a significantly greater dielectric constant. A treatment reactor including a directed energy source apparatus and a delivery mechanism to deliver the reactive gas is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.