David Staines
5Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: Sep 23, 2002 → Dec 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7087538B2 | Method to fill the gap between coupled wafers | Emerging Cross-Sectional Technologies | 218 | Expired |
| US6734118B2 | Dielectric material treatment | Electricity | 6 | Expired |
| US10204855B2 | Bendable and stretchable electronic devices and methods | Electricity | 3 | Active |
| US10468357B2 | Stretchable electronics fabrication method with strain redistribution layer | Electricity | 1 | Active |
| US10206277B2 | Gradient encapsulant protection of devices in stretchable electronics | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.