Multilayer modules with flexible substrates
US6734370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2001 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Sep 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.