Wafer pedestal tilt mechanism and cooling system
US6734439B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | May 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a wafer pad assembly for use in an ion implanter for mounting and cooling a wafer. The wafer pad assembly comprises a wafer support pad having an upper surface for mounting the wafer and a lower surface. The lower surface of the wafer support pad is connected to a coolant passage having an inlet section and an outlet section arranged in an opposed configuration, wherein said inlet section is counterbalanced by said outlet section. The lower surface is connected to a frame having an outer curved surface in mating engagement with a complementary shaped bearing surface of a housing wherein said wafer can be tilted or rotated about an axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.