Semiconductor component and method of producing it

US6734520B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Holger Kapels · Holzkirchen, DE
• Dieter Silber · Eschborn, DE
• Robert Plikat · Eningen unter Achalm, DE

Key dates

• Filing date: May 18, 2001
• Grant date: May 11, 2004
• Expiry date: May 18, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D64/118

Abstract

A semiconductor component includes a first layer and at least one adjacent semiconductor layer or metallic layer, which forms a rectifying junction with the first layer. Further semiconductor layers and metallic layers are provided for contacting the component. Insulating or semi-insulating structures are introduced into the first layer in a plane parallel to the rectifying junction. These structures are shaped like dishes with their edges bent up towards the rectifying junction. A method of producing such a semiconductor component is also provided.