Arrangement and method for transferring a pattern from a mask to a wafer
US6737205B2 · kind B2 · utility
6Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Sep 5, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An arrangement for transferring a pattern from a mask (100) onto a wafer is provided. A product area (110) of the mask (100) is at least partly surrounded by a frame (112) having an alignment mark area (114). In order to avoid the need to produce a specific mask set for different alignment styles, the mask (100) and the frame (112) are designed as being separate units. Further, methods for transferring a pattern from a mask to a wafer are provided that employ a frame separated from a product area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.