Processes for manufacturing flexible wiring boards and the resulting flexible wiring board
US6737588B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Aug 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the second metal film or both is (are) patterned while the bumps are in contact with the first metal film, and the first resin film is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone, and cure the first resin film. After curing, the bumps and the first metal film may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.