Process for mounting electronic device and semiconductor device
US6737741B2 · kind B2 · utility
6Cited by
9References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 21, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Aug 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.