Barrier stack

US6737753B2 · kind B2 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• Institute of Materials Research and Engineering · SG

Inventors

• Senthil A. Kumar · Morrisville, US
• Chua Soo Jin · Singapore, SG
• Mark Auch · Singapore, SG
• Ewald Guenther · Regenstauf, DE

Key dates

• Filing date: Sep 28, 2001
• Grant date: May 18, 2004
• Expiry date: Sep 28, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/844

Abstract

A barrier stack for sealing devices is described. The barrier stack includes at least first and second base layers bonded together with a high barrier adhesive. A base layer includes a flexible support coated on at least one major surface with a barrier layer. The adhesive advantageously seals defects, such as pinholes in the barrier layer, thus improving the barrier properties.