Mark Auch
10Patents
7h-index
7Co-inventors
51Inventor score
Filing activity: Sep 6, 2000 → Feb 12, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6803245B2 | Procedure for encapsulation of electronic devices | Electricity | 110 | Expired |
| US7255823B1 | Encapsulation for oled devices | Electricity | 63 | Expired |
| US6737753B2 | Barrier stack | Electricity | 61 | Expired |
| US7166007B2 | Encapsulation of electronic devices | Electricity | 22 | Expired |
| US7221093B2 | Patterning of electrodes in OLED devices | Electricity | 18 | Expired |
| US8344360B2 | Organic electronic devices with an encapsulation | Electricity | 12 | Expired |
| US7394153B2 | Encapsulation of electronic devices | Electricity | 7 | Expired |
| US7419842B2 | Encapsulation of electroluminescent devices with shaped spacers | Electricity | 5 | Active |
| US7432533B2 | Encapsulation of electronic devices with shaped spacers | Electricity | 5 | Expired |
| US6776050B2 | Support for bending test of flexible substrates | Physics | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.