COF packaged semiconductor
US6737754B2 · kind B2 · utility
2Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Nov 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an active surface and an inactive surface, in which the active surface includes a plurality of contacts. The molding compound contacts both the laminate and the die, but does not contact the die's active or inactive surfaces. The heat dissipation member contacts the die's inactive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.