Ball grid array package with improved thermal characteristics
US6737755B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Dec 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. A semiconductor die is mounted on the first surface of the substrate and an adapter disposed on the semiconductor die. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate, and an encapsulant encapsulates the wirebonds and a remainder of the semiconductor die. A heat spreader has a top portion in contact with the adapter and at least one sidewall extends from the top portion. At least a portion of the at least one sidewall is in contact with the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.