Plasma processing apparatus
US6737812B2 · kind B2 · utility
13Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Jul 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32366
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus processing a surface of a substrate by spraying a process gas in a plasma state from a gas spray opening of a spray nozzle onto the substrate includes: an exhaust opening for exhausting residual gas generated at the time of processing the surface of the substrate, the exhaust opening being provided at a position close to the periphery of the gas spray opening; and an air jet opening generating airflow, the air jet opening being provided surrounding the exhaust opening so as to prevent the residual gas from flowing out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.