Method for removing solder bumps from LSI
US6739045B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Sep 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49822
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.