Process of fabricating a circuitized structure
US6739048B2 · kind B2 · utility
6Cited by
31References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.