Manufacturing method of semiconductor integrated circuit device
US6740171B2 · kind B2 · utility
1Cited by
3References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Feb 27, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/36
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A foreign-matter removal capacity is improved in a cleaning process. When a wafer is cleaned while a brush is moved from the center of the wafer toward the outer circumference thereof, a discharge flow rate of cleaning liquid flowing into the brush is regulated so that the interval between the brush and the wafer is kept constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.