Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US6740576B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace and a metal base, wherein the conductive trace includes a routing line and a contact terminal, the routing line is disposed outside the metal base, the contact terminal extends from the routing line through the metal base, the contact terminal includes a plated metal that contacts and extends through the metal base, the plated metal forms a peripheral sidewall portion of the contact terminal, and the plated metal surrounds a central surface area without extending into the central surface area, then mechanically attaching the chip to the conductive trace, removing a portion of the metal base that contacts the plated metal, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.