Resin molding
US6740709B2 · kind B2 · utility
16Cited by
3References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Feb 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/71
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin molding having welding properties, flexibility, and shock impact resistance in a balanced manner. The resin molding has a welded seam, consisting of a resin composition, wherein the resin composition comprises (a) a polyphenylene sulfide resin and (b) an olefin based resin: wherein an amount of the (a) polyphenylene sulfide resin and the (b) olefin based resin is 80 weight % or more of the entire resin composition, and the content of the (b) olefin based resin is 10 to 100 parts by weight relevant to 100 parts by weight of the (a) polyphenylene sulfide resin, and wherein the tensile elongation at break is 20% or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.