Clear plastic packaging in a CMOS active pixel image sensor
US6740870B1 · kind B1 · utility
41Cited by
8References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1999 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Nov 18, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photosensitive chip element is mounted in a totally clear package. The incoming fight can pass through the package at any angle. The incoming light passed through the package is sensed by the photosensor and converted to a signal indicative thereof. Since the package is clear, no special way of mounting the chip is necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.