Apparatus and method for contacting a conductive layer
US6740945B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Jun 20, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A structure and method for creating a contact between a conductive layer and a pad for dissipating electrostatic charges comprising the steps of, forming a pad and a composite insulating layer between and over conductive plates on a substrate, wherein the insulating layer isolates and protects the conductive plates and pad from damage, the insulating layer comprising a dielectric region underlying a conductive layer. A passivation layer is formed over at least a portion of the conductive layer and a photoresist is patterned over at least a portion of the passivation. An opening is etched through the passivation and the insulating layers, wherein the photoresist and the conductive layer serve as masks. Finally, a conductive material is deposited in the opening to form an electrical contact between the pad and the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.