Method of forming a soldered electrical connection
US6742248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Jan 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.