Robert E. Silhavy
3Patents
2h-index
5Co-inventors
37Inventor score
Filing activity: Jul 19, 2000 → Dec 8, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6375060B1 | Fluxless solder attachment of a microelectronic chip to a substrate | Electricity | 7 | Expired |
| US6742248B2 | Method of forming a soldered electrical connection | Emerging Cross-Sectional Technologies | 6 | Expired |
| US9735088B2 | Systems and methods for thermal control of integrated circuits | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.