Patent · US Expired

Substrates having increased thermal conductivity for semiconductor structures

US6744072B2 · kind B2 · utility

11Cited by

3References

25Claims

0Family size

Assignee

Xerox Corporation · US

Inventors

Linda Romano · Sunnyvale, US
Michael A. Kneissl · Berlin, DE
John E. Northrup · Palo Alto, US

Key dates

Filing date	Oct 2, 2001
Grant date	Jun 1, 2004
Priority date	—
Expiry date	Nov 29, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH10H29/10
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Substrates having increased thermal conductivity are provided, comprising a body having opposed surfaces and a cavity that opens on at least one surface, the cavity containing at least one material having a greater thermal conductivity than the body. Devices are provided comprising a substrate and a semiconductor over a surface of the substrate. Methods of forming devices according to the invention are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.