Leadframe having slots in a die pad
US6744119B2 · kind B2 · utility
9Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Oct 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die pad (81) of a leadframe (8) has a plurality of slots (811-814) that extend through the die pad to define a restrictive region (815). One of the slots extends around a comer of the restrictive region outside where a die (7) is connected to the die pad by solder paste (6). Because of the cohesion of the solder paste, the solder paste does not flow into the slots. The solder paste is thereby restricted to the restrictive region. This prevents the die from drifting or rotating so as to increase the packaging quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.