Patent · US Expired

Semiconductor chip, memory module and method for testing the semiconductor chip

US6744127B2 · kind B2 · utility

8Cited by

8References

3Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Harry Hedler · Germering, DE
Jochen Müller · Hersbruck, DE
Barbara Vasquez · Austin, US

Key dates

Filing date	May 31, 2002
Grant date	Jun 1, 2004
Priority date	—
Expiry date	May 31, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lowermost layer of control chips carries on it layers of memory chips. The memory chips are contacted via looped-through contacts that reach from one side of the other side of the memory chips and they are driven by the control chips that contain the test circuit for the memory chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.