Temperature-controlled thermal platform for automated testing
US6744270B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature-controlled system and method for supporting a wafer or packaged integrated circuit (IC) under test are described. The system includes a thermal platform having a top surface assembly on which the wafer or IC can be mounted. A thermal plate is located under and in thermal communication with the top surface assembly. The thermal plate is made of a porous thermally conductive material. A temperature-controlled fluid such as air enters and propagates radially through the porous material of the thermal plate. The temperature of the wafer or IC is controlled by controlling the temperature of the air passing through the thermal plate. The plate can be made of a sintered metal such as copper or a reticulated foam or a carbon or graphite foam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.