Active trace rerouting
US6748576B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | May 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate of the type for receiving an integrated circuit and a mold cover. The mold cover covers a first portion of the substrate and leaves a second portion of the substrate exposed with a boundary edge between the first portion of the substrate and a second portion of the substrate. The substrate has electrically conductive traces and electrically conductive vias on an upper layer adjacent the mold cover. The electrically conductive traces do not cross the boundary edge on the upper layer of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.