Method and apparatus for securing a metallic substrate to a metallic housing
US6749105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for securing a metallic substrate (24) to a metallic housing (26). The method may include: firing a first solderable coating (64) to an edge (60) of the metallic substrate (24); firing a second solderable coating (64) to a groove (62) of the metallic housing (26); joining the edge (60) of the metallic substrate (24) to the groove (62) of the metallic housing (26) to form a joint (66) at the first solderable coating and the second solderable coating; applying a solder (68) to the joint (66); and solder bonding the metallic substrate (24) to the metallic housing (26) to provide a hermetic seal at the joint (66). There is also an electronic control module that incorporates the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.