Method for producing mounting structure for an electronic component
US6749889B2 · kind B2 · utility
1Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2003 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Apr 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.