Methods to minimize moisture condensation over a substrate in a rapid cycle chamber
US6750155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Mar 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/908
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A chamber for transitioning a semiconductor substrate between modules operating at different pressures is provided. The chamber includes a base defining an outlet. The outlet permits removal of an atmosphere within the chamber to create a vacuum. A substrate support for supporting a semiconductor substrate within the chamber is included. A chamber top having an inlet is included. The inlet is configured to allow for the introduction of a gas into the chamber to displace moisture in a region defined above the substrate support. Sidewalls extending from the base to the chamber top are included. The sidewalls include access ports for entry and exit of a semiconductor substrate from the chamber. A method for conditioning an environment above a region of a semiconductor substrate within a pressure varying interface is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.