Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station
US6752162B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2000 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.