Iodine-containing thermal interface material
US6752204B2 · kind B2 · utility
16Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An iodine-containing thermal interface material disposed between a heat source and a heat dissipation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.