Process for treating adhesion promoted metal surfaces
US6752878B2 · kind B2 · utility
10Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Sep 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/385
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.