Re-coating MEMS devices using dissolved resins
US6753037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/112
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.