Vincent C. Lopes
6Patents
4h-index
7Co-inventors
42Inventor score
Filing activity: Jun 21, 2001 → Nov 15, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6856014B1 | Method for fabricating a lid for a wafer level packaged optical MEMS device | Performing Operations; Transporting | 34 | Expired |
| US6664779B2 | Package with environmental control material carrier | Electricity | 34 | Expired |
| US6753037B2 | Re-coating MEMS devices using dissolved resins | Performing Operations; Transporting | 13 | Expired |
| US7071025B2 | Separating wafers coated with plastic films | Performing Operations; Transporting | 9 | Expired |
| US6879147B2 | Package with environmental control material carrier | Electricity | 3 | Expired |
| US7894121B2 | Light valve assembly with a holographic optical element and a method of making the same | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.