Opto-electronic device integration
US6753197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of creating a hybridized chip using a top active optical device combined with an electronic chip having electronic chip contacts, when at least some of the active device contacts are not aligned with at least some of the electronic chip contacts, each of the at least some active device contacts having an electrically corresponding electronic chip contact. The method involves creating sidewalls defining openings in the substrate, extending from the first side at the active device contacts to a bottom of the substrate opposite the first side, at points substantially coincident with the active device contacts; making the sidewalls electrically conductive; and connecting the points and the electronic chip contacts with an electrically conductive material. A hybridized chip has at least one top active optical device coupled to an electronic chip, the hybridized chip having been created using a described method. A method of connecting two chips, one of which being a topside active chip, each of the two chips having electrically corresponding contacts to be joined together that are physically mismatched relative to each other. The method involves creating electrically conductive …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.