Method for manufacturing an image sensor
US6753203B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 28, 2003 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
Abstract
A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the cavity; providing a plurality of wires to electrically connect the photosensitive chip to the substrate; supplying an adhesive layer to the upper surface of the substrate and within the cavity; mounting a transparent layer to the frame layer to cover the photosensitive chip; and illuminating an electrostatic-charge eliminating light source on the transparent layer to let particles within the cavity fall down to the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.